官方说明书FAIRCHILD Guidelines for Using Fairchilds Power56 数据手册.pdfVIP

FAIRCHILD Guidelines for Using Fairchilds Power56 handbook /file/2687676 From ManualL ManualL collects and classifies the global product instrunction manuals to help users access anytime and anywhere, helping users make better use of products. Home: / Chinese: / This Manual: /file/2687676 AN-9036 Guidelines for Using Fairchilds Power56 Dennis Lang, Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board (PWB) space and RDS(ON) in a convenient, familiar SO-8 sized footprint, with the addition of a large drain tab for improving thermal performance. The Power56 offers a footprint widely used in the industry for enhanced performance SO-8 sized packages. This packaging technology requires mounting techniques, which are slightly different from a conventional SO-8; however, those familiar with mounting packages with large planar areas will find the techniques similar. This note will examine techniques for mounting the Power56 in both prototype and manufacturing environments using eutectic and lead free solder pastes. Figure 1: Power56 Mounted on PWB Component Mounting The process of attaching an electronic component to the PWB is the critical process in determining performance and reliability of a MOSFET. Proper stencil and PWB design is