SMT PCBA生产注意事项.pptVIP

Page 1 附錄 : VLSI製程測定評估項目和量測法 第8章 RMA退貨處理、更換良品之注意事項Notices for handling RMA goods and replacement criteria ? 第 7 章 IC故障分析 ( Failure Analysis ) 7-1.為得真正的不良原因，需做失效分析。 7-2.某些明顯的特徵可用來區別 EOS 或 ESD不良。 7-3.大部份的 EOS不良都是很明顯的接合線開路、燃燒痕跡。7-4.ESD不良是很細小的，不易找出。 7-5.因應IC製程技術不斷創新,相對地 F.A技術亦須提高。 Receive return samples External Visual Pass to subcontractor Scanning Acoustic Tomography (SAT) Baking 24 hours, 125℃ Re-ball Function test Test on Bench Board Return samples to customer Analyze failure mode Download datalog F/A report F/A F/A Pass Fail Pass Fail Pass Fail 7-6.The analysis flow of return samples is as follows : Page 32 of 36 Page 33 of 36 Page 34 of 36 1. Purpose 目的： Illustrate the RMA analysis and exchange criteria of VIAs QA department. 說明 VIAs QA 部門針對客戶RMA退貨的分析、換貨處理原則。 2. Notices for handling 處理注意事項： 2-1. Please RMA dep. of customers sort VIAs IC according to top marking of IC, by product name and revision code, before returning the ICs. Also please do not return the IC with date code thats over one year, because the IC was shipped from VIA for a long time, it must pass the final test of customer, no longer under VIAs warranty. 請客戶RMA單位依據的IC 正印資料予以分類，但是生產週期 （Date Code）超過現在一年以上者，由於該類材料由威盛出貨已 久，客戶應已經過完整的測試程序出貨給市場客戶，多為市場客 戶使用不良的維修換下，因此已不在VIA品質保證的範圍（Out of Warranty）。 2-2.Popcorn failure or serious open/short failure (short failure of VCC-GND or over two failed pins with O/S or functional failure) that are caused abnormal operation or improper storage condition during customers process/rework, VIA will not exchange new parts. 因客戶製程/維修過程中的加工操作不當或儲存及使用條件因素， 造成IC外觀變形或爆板（popcorn），或者嚴重open/short不良者 （超過兩個 pin 以上的open/short ,fun