张英 Cu-9.5Ni-2.3-Sn合金性能的研究批改后 - 副本.docVIP

摘 要 铜基弹性合金广泛应用于医疗、航天航海导航仪器、机械制造、电子电力和仪表制造等行业中，主要用于生产各种载流弹性元件、接触弹簧、开关、转换器、端子类元件。本文以Cu-Ni-Sn系合金为研究对象，利用组织观察、成分分析及导电率硬度、抗拉强度的测量等手段，研究Cu-9.5Ni-2.3Sn合金组织和性能。研究表明： (1)通过对合金铸态组织观察，发现合金铸态组织枝晶发达，枝晶基体为贫Sn相、Cu-Ni固溶体，枝晶间骨状组织为富Sn。 ()由实验数据得出，不考虑热处理的影响，电导率由铸态、冷轧加工态、热轧加工态依次升高；硬度由铸态、热轧加工态、冷轧加工态依次升高。 ()综合考虑合金的显微硬度、导电率以及抗拉强度，合金最佳热处理工艺为，最佳固溶工艺：800℃×2h当时效工艺460℃×4h时，合金硬度为，导电率为11. %IACS，抗拉强度达6MPa，伸长率为10.3%。 关键词：Cu-Ni-Sn系合金；电导率；硬度；组织 ABSTRACT Flexible copper alloy widely used in medical，aerospace and marine navigation equipment，machinery, power electronics and instrumentation manufacturing and other industries，mainly for the production of various carrying elastic elements, the contact springs, switches, converters, terminal class device. In this paper，Cu-Ni-Sn alloys for the study. The structure and properties of the Cu-9.5Ni-2.3Sn alloy were studied by means of metallographic observation, composition analysis, and conductivity, micro-hardness, tensile strength measurements studied. The results show that: (1)Cu-9.5Ni-2.3Sn alloy cast organizations observation found that Cu-9.5Ni-2.3Sn cast alloy developed dendrite, dendritic matrix for the poor of Sn and Cu-Ni solid solution, Dendrite of bone-like organization for rich of Sn. (2)Derived from experimental data, without considering the impact of heat treatment. Conductivity is in turn increased by the cast, cold-rolled processing state and hot state processing; Micro-hardness is in turn increased by the cast, hot rolled processing state and cold-rolled processing state . (3)Considering the microstructure of the alloy hardness, conductivity and tensile strength, the best solution process:800℃ × 2h.After aging process (460℃ × 4h), Cu-9.5Ni-2.3Sn alloy micro-hardness was HV210,conductive rate was 11.7% IACS, the tensile strength was up to 641MPa with 10.3% elongation. Key words:Cu-Ni-Sn alloys；Aging Process；Conductivity；Hardness；Organizational 目 录 第一章 文献综述 1 1.1引言 1 1.1.1铜及铜合金的应用现状 1 1.2高强度高导电性铜合金应用现状 3 1.2.1获得高强高导铜合金的几种常用方法 3 1.3弹性铜合金的研究