毕业设计论文-金属注射成形MoCu电子封装材料的性能研究.docVIP

摘　　要 Mo/Cu材料具有较高的导热系数、较低的热膨胀系数以及较好的耐热性能。其具有较高的导热系数可以作为大功率电子器件和散热器件，较好的耐热性可以作为高温构件等。 低铜含量Mo/Cu合金兼具热膨胀系数小和导电导热性能好的优点，作为电子封装和热沉材料，在基片、连接件和散热元件等电子封装领域有着广泛的应用。金属注射成形技术在制备具有复杂几何形状，均匀组织结构和高性能的近净形金属零部件方面具有独特的优势。本研究采用注射成形工艺制备出铜含量低于20%（体积分数）Mo/Cu合金，探讨了影响合金性能（热导率、热膨胀系数等）的主要因素。研究表明：合金热导率受残余孔隙的影响很大，任何能影响合金烧结密度的因素都对热导率有较大影响；杂质铁的增加对热导率的影响明显，0.4%的铁可以降低合金约25%的热导率。研究条件下获得铜含量为15%、16%和18%合金的最佳热导率和热膨胀系数分别为157W/m·K，161W/m·K，170W/ m·K和6.51×10-6/K，6.97×10-6/K和7.31×10-6/K，接近或达到国外水平。合金的热膨胀系数受到残余应力、铜含量等因素影响。 关键词：Mo/Cu合金 热导率 热膨胀系数  ABSTRACT Mo/Cu material has the high thermal conductivity coefficient and lower thermal expansion coefficient and good heat resistance. Since it has high thermal conductivity , therefore it can be used as high power electronic devices and cooling device. Since it has good heat resistance ，and therefore it can be used as high temperature components. Low copper content Mo/Cu alloy thermal expansion coefficient with small and conductive heat conduction performance advantages, as electronic packaging material and heat sink, in the substrate, the fittings and heat dissipation components and other electronic assembly field in a wide range of applications.Low copper content Mo/Cu alloy thermal expansion coefficient with small and conductive heat conduction performance advantages, as electronic packaging material and heat sink, in the substrate, the fittings and heat dissipation components and other electronic assembly field in a wide range of applications.In the study, the injection molding process preparation copper content out less than 20% (volume fraction) Mo/Cu alloy, discusses the influence alloy performance (thermal conductivity, thermal expansion coefficient, etc) the main factors.In the study, the injection molding process preparation copper content out less than 20% (volume fraction) Mo/Cu alloy, discusses the influence alloy performance (thermal conductivity, thermal expansion coefficient, etc) the main factors.Research shows that: alloy therma