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夹ti合金层激光焊接高比分sicp2024铝基复合材料-laser welding high score sicp 2024 aluminum matrix composite with ti alloy layer.docx

夹ti合金层激光焊接高比分sicp2024铝基复合材料-laser welding high score sicp 2024 aluminum matrix composite with ti alloy layer.docx

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夹ti合金层激光焊接高比分sicp2024铝基复合材料-laser welding high score sicp 2024 aluminum matrix composite with ti alloy layer

AbstractHighvolumefractionSiCparticlereinforcedaluminummatrixcompositeshavebeenwidelyusedinaviation,aerospace,electronicpackagingandotherfieldsbecausehighstiffness,lowthermalexpansioncoefficientandwelldimensionalstability.However,withtheincreaseofthereinforcementvolumefraction,thematerialweldabilitywilldecreasedsubstantially.Cracksandneedle-likeAl4C3formedbetweentheSiCandAlwillseriouslyreducethemechanicalpropertiesoftheweldInthispaper,highvolumefraction(45%)SiCP/2024aluminummatrixcompositewasjiontusingTi-6Al-4Vfoilasintermediatematerialbylaser.In-situreactionbetweenparticlesandTimaketheweldingprocesseasy.Theweldstrengthwastestedandthefracturebehavior,phasestructureandweldpoolcrystallizationprocessweredeeplystudied.Thethicknessandlaserpowerhavegreateffectbothontheinterfacemorphologyandbeadformation.Ti-6Al-4Vsilcesofdifferentthickness(0.3~1.0mm)wereselectedtojointhebasemental.TheresultsshowedthereisnoreactionlayerwiththinnerTi-6Al-4Vfoil(d≤0.3mm),Fracturebehaviorofjointsoccurredintheweldcenter.TensilestrengthwerehigherthanthejointwiththickerTifoils,Thegreatesttensilestrengthwas125.6Mpa.ThereisasignificantinterfacereactionlayerbetweentheweldandbasemetalwiththickerTi-6Al-4Vfoil(d≥0.5mm).Thejointswerebrokenattheinterfacewithlowertensilestrength.SEM,EDSandXRDwereusedtoanalyzethemicrostructureoftheweld.TheweldwasconstitutedmainlybyTi5Si3,AlTi3andTiCwithcrystallizationorderofTiC→Ti5Si3→AlTi3.ThegrowthmechanismofTiCwasanalyzedwhichwastheproductofthein-situreactionKeywords:highvolumefractionSiCP/2024,laserwelding,In-situ,TiC目录摘要................................................................................................................................IAbstract............................................................................................................................II第1章绪论....................................................................................................................11.1引言..................................................................

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