maximum_temperature_detection_system_for_integrated_circuits…5—论文.pdfVIP

Journal of ELECTRICAL ENGINEERING, VOL. 66, NO. 2, 2015, 79–84 MAXIMUM TEMPERATURE DETECTION SYSTEM FOR INTEGRATED CIRCUITS ∗ Maciej Frankiewicz — Andrzej Kos The paper describes structure and measurement results of the system detecting present maximum temperature on the surface of an integrated circuit. The system consists of the set of proportional to absolute temperature sensors, temperature processing path and a digital part designed in VHDL. Analogue parts of the circuit where designed with full-custom technique. The system is a part of temperature-controlled oscillator circuit — a power management system based on dynamic frequency scaling method. The oscillator cooperates with microprocessor dedicated for thermal experiments. The whole system is implemented in UMC CMOS 0.18 µm (1.8 V) technology. K e y w o r d s: TCO, DFS, VLSI, CMOS 1 INTRODUCTION of the chip. Designed TCO cooperates with OctaLynx microprocessor which is a prototype circuit designed by Because of scaling down the technology node of mod- a team together with authors of this paper for thermal ern digital integrated circuits (IC) the power density in- test purposes. The whole system of TCO with the proces- side the package is increasing significantly in late years [1]. sor is designed in UMC CMOS 0.18 µm (1.8 V) technol- As an effect the operating temperature of the chip is ris- ogy. The analogue part of the system (sensors, analogue ing and endangers the circuit to overheating [2]. For that multiplexer and temperature compara