p型gan上azo膜制备及欧姆接触特性-preparation and ohmic contact characteristics of azo films on p - gan.docxVIP
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p型gan上azo膜制备及欧姆接触特性-preparation and ohmic contact characteristics of azo films on p - gan
opticalbandgapofAZOthinfilmwascalculatedbySwanepoelmethodandmechanismwasanalyzed.OwingtotheexcellentelectricalandopitcalpropertiesofAZOthinfilm,itcanbeapromisingmaterialastransparentelectrodeintheGaN-basedoptoelectronicdevices.Therefore,theI-VcharacteristicsofNi/AZOcontactsonp-GaNhavebeeninvestigated,ItwasfoundthatalinearbehavioroftheI-Vcharacteristicscanbeobtainedafterrapidthermalannealedat400℃and500℃inair,whichindicatestheformationofanohmiccontactafurtherincreaseintheannealingtemperaturedeterioratedthecontactresistivity,theI-Vcurveswererectifiedinthesampleannealedcat550℃,thespecificcontactresistances(???)is2.2927×10-2Ω.cm2afterannealedat400℃.AlthoughtheNi/AZOcontacttop-GaNresultedinohmicbehaviorafterannealing,theopticalcharacterizationofthesefilmswasanotherimportantissue,thetransmittancespectraagainstwavelengthfortheNi/AZOsamplesannealedatvariousannealedtemperatureunderairconditions,thelighttransmissionwaslowerthan50%forthepre-annealedsample,andincreasedto60~70%at400~600nmforthesampleannealedat400℃inair.Keywords:AZOThinFilm,DCReactiveMagnetronSputtering,OhmicContact;TransparentElectrode.目录中文摘要..........................................................................................................................................I英文摘要........................................................................................................................................II1绪论......................................................................................................................................11.1问题的提出及研究意义...........................................................................................................12.1直流磁控溅射方法.................................................................................................................112.1.1直流反应溅射镀膜的基本原理......................................................................................112.1.2薄膜制备的工艺特征......................................................................................................
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