基于改进模板匹配晶圆划切算法.pdfVIP

Journal of Image and Signal Processing 图像与信号处理, 2017, 6(3), 139-146 Published Online July 2017 in Hans. /journal/jisp /10.12677/jisp.2017.63017 Algorithm for Wafer Slicing Based on Improved Template Matching * Chenshu Gao, Rui Zhai, Jian Xue , Ke Lv School of Engineering Science, University of Chinese Academy of Sciences, Beijing th rd th Received: Jun. 15 , 2017; accepted: Jul. 3 , 2017; published: Jul. 6 , 2017 Abstract Nowadays the domestic industrial applications of wafer automatic slicing mainly adopt gray-based template matching method. However, its calculation is quite time-consuming with low slicing effi- ciency. This paper proposes an improved template matching algorithm based on geometric edge to achieve the goal of accelerating the traditional algorithm. It generates appropriate edge template by Canny edge detection; calculates the gradient direction of template edge curve, which is used to calculate similarity as matching information; optimizes the searching strategy by using the similar- ity threshold determination. Then, the rough traversal matching is implemented at the top layer of the image pyramid and the matching process continues layer by layer until the bottom. The result of experiment shows that the algorithm proposed in this paper performs high robustness, which can obtain good matching result under different conditions of objectives, including uniform or non-uniform illumination and partial occlusion. Besides, it meets the real-time requirement while the accuracy is ensured, which can be applied to practical industry of automatic wafer image slicing. Keywords Template Matching, Geometric Features, Similarity Measures Function,