High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产.pdfVIP

High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring 216 High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring Norio Michigami OVERVIEW: Recent years have seen dramatic progress in the performance Masatoshi Yamaga of electronic devices such as mobile phones, notebook PCs, and electronic Masahiro Kawamura books. These performance improvements require not only the miniaturization and performance enhancement of the semiconductors and other components Osamu Kuze used in these devices but also the ability to achieve higher densities, multi- Shigeo Nakamura layer structures, and smaller hole diameters in the PCBs on which these components are mounted to form electronic circuits. As a manufacturer of production machinery for PCBs, Hitachi Via Mechanics, Ltd. supplies mechanical and laser drilling machines able to drill small-diameter interlayer connection holes with high speed and precision and direct exposure machines capable of producing the very fine wiring and high precision needed for higher wiring densities. These machines are supplied to the PCB industry throughout the world where they contribute to improvements in the performance of electronic device