TemperatureAware Design温度感知的设计.pptVIP

Temperature-Aware Design Presented by Mehul Shah 4/29/04 The Problem Power Thermal densities are increasing Currently @ 50W/cm2, 100W/cm2 @ 50nm technology Power density doubles every 3 years Operating Vdd scaling much more slowly (ITRS) Cost of cooling rising exponentially $1 - $3 per Watt of power dissipation Packages designed for worst case power Hot spots – heat dissipation non-uniform across chip Low-Power design techniques not sufficient Big Hammer : Global Clock Gating limits performance Impact of Temperature on Design Increased Delay, Lower Reliability Slower Transistors Carrier mobility lower at higher temperature Inverter 35% slower at 110o C vs. 60o C Higher Leakage Power By orders of magnitude at higher temperature Leakage becoming more significant than switching power Higher Metal Resistivity Copper 39% more resistive at 120o C vs. 20o C Lower Mean-Time-To-Failure (MTF) MTF = MTFo exp (Ea / kb T) MTF decreases exponentially w/ Temperature Moral of the Story Problem: Temperature adversely affects power, performance reliability Solution: “Temperature-Aware” Design Temperature Aware Design Thermal Modeling Estimate Operating Temperature Simple : Allow architects to easily reason about thermal effects Detailed : Model runtime temperature at Functional-Unit granularity Computationally Efficient Flexible : Easily extend to novel architectures Dynamic Thermal Management Use runtime behavior and thermal status to adjust/distribute workload among Functional-Units Talk Outline Thermal Modeling Model Description Validation Case Studies Dynamic Thermal Management Results Conclusions References Kevin Skadron et. al, “Temperature-Aware Microarchitecture” Wei Huang et. al, Compact Thermal Modeling for Temperature-Aware Design” Thermal Modeling Thermal model interacts with Power, Performance, Reliability models Design convergence requires several iterations Heat Flow vs. Electrical Phenomenon Both can be described by the same differential equations Heat Flow