controlplan与cp比对0324.xls

信賴度測試檢驗頻率 可接受條件 檢驗頻率 設備線別 OLE_LINK2 Process Production Line /Equipment Production Line /Equipment No. In-process inspection / Frequency Acceptance criteria Item In Process Quality Control Process Monitoring Item Monitoring Item / Frequency Equipment Material Issue Laminate Cutting Schelling # A / B 1.Copper thickness/ Laminate thickness/size:1pnl / Lot 2. Panel Issue size: 1pnl /PN Per PN spec I/L Pre-treat Schmid Universal # B # C I/L Dry film Laminate Hakuto 610i C-Sun A25D # A/B/C/D/E G/H/I I/L Exposure ORC Perform 7000 C-Sun UVE-A220 UVE-M535L UVE-M535F # B/C/D # E/F # D/E # A/B/C Dry film exposure quality check :2pnls/45pnls. No nick/open /short common defects I/L DES Line 2. All sampling layers must be inspected 100% by AOI I/L Punch Multiline ATP-3000 Multiline ATP 1000 # D # B/C Check concentric circles, burr :once / shift No breakout / burr allowed I/L AOI #A/B #F/G/H/J/K I/L VRS Verismart VRS-4I VRS-5I #Y/Z/AA/AB/AC/AF #P/T/Q/U/V/E /#AD/AE/X Follow AOI inspect data I/L Trace welding SL-100 JYS-SW #B #C （This item IBM have not approved yet） 1. Weld Repair, 100% 2. Resistance Check, 100% 1.?????? 3M tape 2.?????? CIE 122 1.?????? No trace peeling off 2.?????? 1ohm Oxide Atotech MacDermid #D Fusion Bonding Cedal InduBond 130 single drawer Cedal InduBond 200 double drawer #A/B/C/D/E/F/G #H 1. X-ray Check concentric circles:100% 1.No breakout allowed 2.Per PN Stack-up Eyelet Chiao’s JS7732 single-head #7/8/9/10/11 Lamination LienChien LHMCVL-350-10 #E/F/G/H X-Ray Target DLF CH602 Muraki 880 # B,C 1.Per PN spec 2.+/-4mi 3.Per PN spec 1.Layer-to-Layer Registration :100% 1.X-ray Inspection Machine 2. Micrometer 1.+/-4mil Drill （ First Secondary Drill） Hitachi 100KRPM Hitachi 160KRPM Tong Tai CPD-7620 200KRPM Tong Tai CPD-7520 200KRPM Machvision Hole AOI #A1~A5/A11~A15/A21 #1 1.X-ray check: bottom boards of every spindle 1.No breakout /wrong hole count/ wrong hole size 2.+/-3mil Hole Location accuracy inspect : Bottom boards / Each spindle / Drill Machine;It wil