微细电极电火花磨削装置及运丝系统稳定性分析-stability analysis of micro-electrode edm grinding device and wire conveying system.docxVIP

哈尔滨工业大学工程硕士学位论文 哈尔滨工业大学工程硕士学位论文 -II -II - Abstract With the development of sience and technology, precision and miniaturization of mechanical structure has become the major trends in manufacturing fields. Minute structure components are widely applied in all kinds of equipments which are of high accuracy. Many precision parts of which the main structure is micro array holes take irreplaceable role in printing and medical equipments. In all kinds of micro electrodes machining methods, micro-EDM is very excellent because of its non-contact processing and non-macroscopic mechanical force. Micro-electrodes that have good surface quality and high precision are necessary when micro array holes are machined by micro-EDM. So, researching on WEDG device that can supply wire electrodes initiatively and stability of wire transport system has great significance. This thesis establishes the mathematical models of transport system of traditional and new WEDG device, then analyzes the relation between wire tension and frequency with Matlab software. The thesis draws the conclusion that how different radiuses of wheel and length of wire electrode between two wheels affect wire tension response and also finds that the device with supplying wire function is more stable. Based on the theoretical analysis above, the thesis designs the grinding structure, supplying wire structure and gathering wire structure to make the wire electrode move with constant speed and wire tension. The thesis arranges all rollers reasonably. With belt and hysteresis brake, the device can provide constant tension for the wire electrode. Due to the designing of supplying wire device, the vibration interference from the wire roller can be restrained. Then the main parts and structures are optimized with Ansys software to reduce the deformation of discharge wheel’s mounting hole. Finaly, the thesis builds an experimental platform of WEDG system based on CCD machine vision and explores how wire tension, wire spee