E-beam Lithography_Process technology文档.pptVIP

Lithography Training Course Process Technology MMIC-HEMT, ETH Zürich Electrical nm-contacts, Uni Basel Luft InP 70 nm DFB-Laser, WSI München Applications: Nanodevices L=230 nm Nanoelectronics Optics Basic Research Nano-“mechanics“ ?Nanopendulum“, LMU TH Aachen Magnetoelectronics EBL Coating or stripping step Remover Lift-Off Etching metal Remover Pattern Transfer substrate substrate resist substrate Spin coating Exposure substrate Developing Wafer After x process steps Process Technology Raith support Special Knowledge, e.g. EBL resist database General Knowledge Process Technology substrate substrate resist substrate Spin coating Exposure substrate Developing Remover Lift-Off Etching metal Remover Pattern Transfer Raith Application Lab: Typical Instrumentation Process step substrate substrate substrate Spin coating Exposure substrate Developing Cleaning Spin coating Film thickness measurement Exposure Developing Inspection Instrumentation Film thickness measurement Cleaning Spin coating Exposure Developing Inspection wet bench (eye-) shower for accidents with acids storage for chemicals stove / hotplate refrigerator spin coater stove / hotplate Film Thickness Probe Raith 150 wet bench storage for chemicals optical microscope sputtering machine Raith 150 Lift-Off Tips Tricks obtain an undercut resist profile by if possible use evaporation, not sputtering using a double layer resist using low beam energy overexposure or overdeveloping use an aspect ratio of resist: metal as large as possible Resist Wafer apply postbake to  improve resist stability  during etching for organic resists  avoid etching  processes with oxygen Wafer Tips Tricks obtain cross-sections without undercut or overcut by using high beam energy avoiding overexposure  and overdeveloping Etching Process Steps substrate substrate resist substrate Spin coating Exposure substrate Developing Wafer e.g. electron beam lithography inspection