微小互连高度下焊点界面反应及力学性能分析-analysis of interfacial reaction and mechanical properties of solder joints at micro interconnection height.docx

华中科技大学博士学位论文 华 中 科 技 大 学 博 士 学 位 论 文 IV IV process. Based on the ratio of Cu to Sn diffusion fluxes at the Cu3Sn/Cu6Sn5 interface, the growth model of Cu6Sn5 layer and Cu3Sn layer has been established. According to the growth model, the Cu3Sn grows fast at the cost of Cu6Sn5 layer at the early stage, while, the thickness of the total IMC layers increases with the aging process. Moreover, the thinner original Cu6Sn5 layer, the faster the IMC growth. With the aging process, the growth rate of Cu3Sn slows down, as well as the consumption rate of the Cu6Sn5 layer, at this time, the IMC growth depends on the reaction between diffusion fluxes of Cu and Sn at the Cu3Sn/Cu6Sn5 interface. Finally, the IMC thickness would grow similarly. Because of the coarsened Sn grains in the solder joints with multiple grains in height during the aging process, the UTS decreases, and the fractures occur in the solder bulk; the fracture of the aged solder joint with 10μm SOH occurs with the delamination of Cu3Sn/Cu6Sn5 interface, which is different from the fracture mode before aging. The study of the as-reflowed and aged Cu/Sn/Ni solder joints reveals the change rules of the micrstructure and mechanical property of the solder joints with different base materials at the two sides. Due to the coupling effect during the reflow process, the incompact duplex IMC layers of the thin Ni-Cu-Sn layer and the deposited (Cu,Ni)6Sn5 layer at Ni side are formed, therefore, fractures occur in the IMC layer at Ni side for all Cu/Sn/Ni solder joints in the tensile test with a constant crosshead speed of 0.1mm/min. In the aging process, the thin Ni-Cu-Sn layer would transform into (Ni,Cu)3Sn4, which also have a weak bonding with the deposited (Cu,Ni)6Sn5 layer, as a result, the fracture of the aged solder joints mostly occurs at the (Ni,Cu)3Sn4/(Cu,Ni)6Sn5 interface. The study compared the microstructure and mechanical property of the as-reflowed sandwich solder joints with the same or different materials