高集成度混合功率模块的方案.pdf

TND6031/D ON Semiconductor Hybrid Power Solutions TECHNICAL NOTE Technology Overview – Insulated Metal Substrate Technology (IMST) Prior to its acquisition by ON Semiconductor, SANYO integrated circuits like gate drivers, microcontrollers, Semiconductor became the first company in the world (in transceivers, etc.) together with the actual power devices in 1969) to develop IMST, or Insulated Metal Substrate the power module which – beyond the legacy use of Technology, which enables complex electronic circuits on implementing standard power modules (PIMs) – also plates of aluminum, that is to say, on metal substrates. enables the implementation of system power solutions Compared to standard FR4 PCBs, aluminum substrate based (IPMs). Thanks to the long experience building power solutions provide high thermal conductivity combined with modules (commonly known as STK modules) for various excellent shielding and isolation capabilities. Different to markets, ON Semiconductor/SANYO Semiconductor is in frame-based power module implementations, IMST enables a leading position to develop and deliver high density, high the co-integration of various components (passive performance and high reliability power module solutions for components, discrete active components up to complex several automotive and industrial applications. Figure 1. IMST Composition  Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: April, 2013 − Rev. 2