【毕业设计论文】微处理器工艺及其电性能测试技术.docVIP

精品 PAGE \* MERGEFORMAT PAGE \* MERGEFORMAT 1 微处理器工艺及其电性能测试技术 摘要：半导体产业向前迈进的重要一步是将多个电子元件集成在一个硅衬底上，被称为集成电路或简称IC。而进入二十一世纪以来，随着人类对集成电路的深入认识和广泛应用，带来了世界经济与技术的飞速发展和社会的深刻变革，它正日益改变着人们的生活方式和交流方式，人类由此进入了一个新的信息化文明时代，其中以微处理器为核心的集成电路（IC）技术向来是信息产业的两大核心技术之一，是现代信息技术的“心脏”。但其超高的集成度无疑对工艺制造及可靠性检测都是一项挑战，就此本文将简述微处理器的封装测试技术并就电性能测试做详细介绍。 关键字：集成电路， 微处理器， 电性能测试 Abstract：The semiconductor industry makes great strides forward importantly one step is forward many electronic component integration on a silicon substrate, is called the integrated circuit or is called IC.But since has entered for the 21st century, along with the humanity to the integrated circuit thorough understanding and the widespread application, has brought the world economics and the technical rapid development and societys profound transformation, it is changing peoples life style and the exchange way, the humanity from this entered a new informationization civilized time, in which take the microprocessor as the core integrated circuit (IC) technology always is day by day information industries one of two big core technologies, is the modern information technology “the heart”.But its superelevation integration rate to the craft manufacture and the reliable examination all is a challenge without doubt, this article will summarize the microprocessor seal test technology in light of this and makes the detailed introduction on the electricity performance test. Keywords: IC, Microprocessor, Electricity performance test 目录 第一章 集成电路芯片概述··································3 1.1集成电路简介···············································3 1.1.1 集成电路的概念及分类··································3 1.1.2 集成电路的发展史······································3 1.1.3 我国半导体产业现状····································7 第二章 微处理器制造工艺技术······························9 2.1 材料及制备·················································9 2.11制备单晶硅·············································9 2.12晶圆工艺···············································10 2.2微处