多孔微热沉大功率LED阵列散热数值分析-ChinaXiv.PDFVIP

                 多孔微热沉大功率 LED 阵列散热数值分析 1 2,1 1 2 2 1 王永翔 ，万忠民 ,常华伟 ,万军华 ，黄重庆 ，舒水明 (1. 华中科技大学能源与动力工程学院 武汉 430074 2. 湖南理工学院信息学院 岳阳 414006) 摘 要：对采用多孔微热沉的大功率LED阵列主动散热方案进行散热分析，系统采用一个微泵驱动，依靠封闭多孔微热沉系统实 现大功率LED阵列的高效散热。数值分析表明：在没有采用多孔微热沉而仅依靠冷却工质散热的情况下，芯片最高温度为87 ℃， 采用上述冷却方案后，芯片温度大幅度降低，系统散热效果明显改善。并且孔隙率和工质入口流速都对系统换热有很大的影响。 研究结果表明多孔微热沉系统可以有效解决大功率LED阵列散热问题，提高LED芯片的寿命和性能。 关键字：大功率LED阵列；多孔微热沉；散热；数值分析 中图分类号：TN312.8 文献标识码：A 1 Numerical Analysis on Porous Micro Heat Sink for High Power LED Array v 1 2,1,* 1 2 2 1 1 Wang Yong-Xiang , Wan Zhong-Min. , Chang Hua-Wei , Wan Jun-Hua , Huang Chong-Qing ，Shu Shui-Ming 9 (1. School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074; 0 0 2. School of Information Engineering, Hunan Institute of Science and Technology, Yueyang 414006) 0 Abstract: An active cooling system that uses the porous micro heat sink is presented for thermal management of . 2 high power LED (light emitting diode) array, which is driven by a micro-pump. According to the analysis results, 0 the maximum temperature of the chip would raise highly to 87 ℃, without the micro-porous heat sink. With the 8 1 help of the cooling system, the chip temperature is sharply reduced, and the cooling effect of this system is 0 significantly improved. In addition, the different porosity and the fluid inlet velocity can affect the perfor