检测报告TestReport-桥式整流器二极管.PDF

检测报告 Test Report 报告编号 ECL01K006334001ER1 第1 页共43 页 Report No. ECL01K006334001ER1 Page 1 of 43 申请单位 山东迪一电子科技有限公司 Applicant SHANDONG DIYI ELECTRONIC SCIENCE AND TECHNOLOGY CO., LTD 地 址 山东省济宁市兖州经济开发区创业路7 号 Address NO . 7 CHUANGYE ROAD, ECONOMIC DEVELOPMENT ZONE, YANZHOU DISTRICT, JINING , SHANDONG PROVINCE, P.R.C. 以下测试之样品及样品信息由申请者提供并确认 The following sample(s)and sample information was/were submitted and identified by/on the behalf of the client 序号No. 成品名称Final Product Name 样品名称 Sample Name 001 塑封料Molding Compound 002 芯片 Die 003 二极管、整流桥 锡膏Solder Paste 004 DiodeBridge 环氧树脂 （无卤）Molding Compund （Halogen free ） 005 铜框架Lead Frame 006 铜引脚镀层Tin Plating 客户参考信息 Client R- 1/A-405/DO-41/DO- 15/DO-201AD/R-6， Reference Information D3K/KBP/KBL/KBJ/KBU/GBU/GBJ/KBPC/GBPC,DBS/DBM/MBF/MBS/M BM/ABS/ABF/SMA/SMAF/SMB/SMBF/SOD 123FL/DFN/DBF/TO-277/SOT 23/TO-92/SOD- 123/SMC/SOD-323/GBL/SOT-23/SOD-523/WOB/MELF/DO- 35/ LL-34/LL-41 样品接收日期 2018.01.30 Sample Received Date Jan. 30, 2018 样品检测日期 2018.01.30-2018.02.09 Testing Period Jan. 30, 2018 to Feb. 9, 2018 检测要求/检测依据/检测结果 请参见下页。 Test Requested/Test Method/Test Result(s) Please refer to the following page(s). 主 检 审 核 Tested by Reviewed by 批 准