pcb制程跟原理.pptVIP

IAC Confidential * 8.黑化 (Oxide Coating) 7.去乾膜 (Strip Resist) IAC Confidential * 9.疊板(Lay-up) Layer 1 Layer 2 Layer 3 Layer 4 Copper Foil Copper Foil Inner Layer Prepreg(膠片) Prepreg(膠片) IAC Confidential * 10.壓合(Lamination) 墊木板 鋁板 11.鑽孔(P.T.H.或盲孔Via) (Drill Deburr) IAC Confidential * 12.鍍通孔及一次電鍍 (Desmear Copper Deposition) 13.外層壓膜(D/F Photo Resist Coat) Photo Resist IAC Confidential * 14.外層曝光(Expose) 15.曝光後(After Expose) uv光源 IAC Confidential * 16.外層顯影 (Develop) 17.線路蝕刻(酸性蝕刻) (Etch) IAC Confidential * 18.去乾膜 (Strip Resist) 19.噴塗(液狀綠漆) (Solder Mask Coat) IAC Confidential * 20.防焊曝