SMT资料BGA双球枕头效应原因分析及改善对策BGAsoldering-Headinpillow.ppt

BGA Soldering-Head In Pillow In-situ observation of BGA soldering Classification of BGA soldering failure mode Case study for BGA soldering Outline 1-1 Observation of BGA soldering gap change In-situ observation of BGA soldering Peak Temp. Cooling down PKG PCB Solder sphere Solder paste Flux clean tin oxide Solder ball paste melt at melting point Thicker oxide and weaker flux activity caused non-melting During peak cooling Non-melting caused head in pillow Reflow Profile of Process Classification of BGA soldering failure mode a. Void b. Bridge d. Crack e. Head-in-Pillow f. Non-wetting c