毕业论文设计《胶液分配技术论文》.docVIP

摘 要 微电子技术的迅猛发展，带动了封装技术及封装设备的发展。作为封装工艺中的关键设备，胶液分配技术也得到了广泛的发展。胶液分配的方式有时间压力式、螺杆泵式、活塞泵式等。 文章通过对便携式电子产品封装发展小型化趋势的分析，阐明了液态点胶材料的普及应用的必然性，进一步分析研究液态喷胶技术，比较传统的针头式点胶系统和喷射式点胶系统，说明喷射式点胶系统的特性：高效、高可靠性（无接触）、低成本，分析研究关键工艺参数的影响，归纳无接触式点胶技术应用的一些关键技术工艺参数点，展望市场的前景，阐明未来点胶技术的发展必然趋势。 关键词：液态点胶；喷射式点胶；无接式触点胶 ABSTRACT The IC packaging technology and the relevant equipments are rapidly developing with the development of microelectronics technology．The dispensing technology is widely using today for it is key equipment in IC packaging．There are several types of dispensing：time-pressure，Archimedes pump，piston pump and jetting． In this paper, author performs some trend analysis especially as for the size for portable electronics product: the size is keeping continuing shrinking. Also perform some comparison study between traditional needle dispensing technology and newly developed jetting-noncontact dispensing technology. The mainly advantage of jetting-noncontact dispensing technology: higher productivity, higher reliability and low cost. Point out that noncontact dispensing is the trend of dispensing technology. Key words：liquid dispensing technology； jetting dispensing technology； Noncontact；dispensing technology目 录 TOC \o 1-4 \h \z \u HYPERLINK \l _Toc263758382 第一章 绪论 PAGEREF _Toc263758382 \h - 1 - HYPERLINK \l _Toc263758383 1.1 引言 PAGEREF _Toc263758383 \h - 1 - HYPERLINK \l _Toc263758384 1.2 胶液分配技术的发展 PAGEREF _Toc263758384 \h - 1 - HYPERLINK \l _Toc263758385 1.3 几种胶液分配技术的比较 PAGEREF _Toc263758385 \h - 2 - HYPERLINK \l _Toc263758386 1.4 液态点胶最新技术 PAGEREF _Toc263758386 \h - 3 - HYPERLINK \l _Toc263758387 1.4.1 针头点胶技术 PAGEREF _Toc263758387 \h - 3 - HYPERLINK \l _Toc263758388 1.4.2 喷射式点胶技术 PAGEREF _Toc263758388 \h - 3 - HYPERLINK \l _Toc263758389 1.4.3 两种点胶技术的比较 PAGEREF _Toc263758389 \h - 4 - HYPERLINK \l _Toc263758390 1.4.4 喷射方法 PAGEREF _Toc263758390 \h - 5 - HYPERLINK \l _Toc263758391 1.5 课题的来源与研究内容 PAGEREF _Toc263758391 \h - 6 - HYPERLINK \l _Toc263758392 1.6 本次