高速背板连接器hm-zd-footprintoptimization.pdf

INTERCONNECT APPLICATION NOTE Z-PACK HM-Zd PWB Footprint Optimization for Routing Report # 20GC015-1, Rev. B July 10, 2003  Copyright 2003 Tyco Electronics Corporation, Harrisburg, PA  All Rights Reserved CD REPORT #20GC015-1, Rev. B : Z-PACK HM-Zd, PWB Footprint Optimization for Routing Table of Contents Item Page # I. INTRODUCTION1 II. Z-PACK HM-Zd 3 III. CONNECTOR FOOTPRINT4 A. Dimensions 4 B. Fabrication Technology 5 1. Pad Size6 2. Antipad Size6 3. Non-functional Pads11 IV. SUMMARY 12 V. ADDITIONAL INFORMATION13 A. Z-PACK HM-Zd13 B. Gigabit Research General Application Notes13 C. Electrical SPICE Models 13 VI. CONTACT INFORMATION13 A. Tyco Electronics 13 B. Communications Circuits Design 14 VII. REVISION HISTORY 15 The information contained herein and the models used in this analysis are applicable solely to the specified AMP connector. Alternative connectors may be footprint-compatible, but their electrical performance may vary significantly, due to construction or material characteristics. Usage of the information, models, or analysis for any other connector is improper, and AMP disclaims any and all liability or potential liability