一种多链式结构的3D-SIC过硅通孔TSV容错方案-计算机工程与应用.PDF

Computer Engineering and Applications 计算机工程与应用 2012 ，48 （20 ） 75 一种多链式结构的3D-SIC 过硅通孔（TSV ）容错方案 1 1 1 2 王 伟 ，董福弟 ，陈 田 ，方 芳 1 1 1 2 WANG Wei , DONG Fudi , CHEN Tian , FANG Fang 1.合肥工业大学 计算机与信息学院，合肥 230009 2.合肥工业大学 管理学院，合肥 230009 1.School of Computer and Information, Hefei University of Technology, Hefei 230009, China 2.School of Management, Hefei University of Technology, Hefei 230009, China WANG Wei, DONG Fudi, CHEN Tian, et al. 3D-SIC TSV fault-tolerant scheme based on multi-chains. Com- puter Engineering and Applications, 2012, 48 （20 ）：75-80. Abstract ：People are gradually pay attention to the Three-Dimensional （3D ）Circuits owing to its higher density, higher ratio and lower power. Now Through Silicon Via （TSV ）is the main issue to provide the communication links between the vertical dies in 3D Circuits. However, there will be some failure TSV owing to the limitation of manu- facturing, and a failed TSV will cause the modules or the whole chip failure. A fault-tolerant scheme based on multi-chains is proposed, the TSV chain is constituted by several TSV, which makes several TSV chains reuse the re- dundant TSV to resume the failure chip. According to the experimental results, the entire resume ratio can be up to 90% while the number of redundant TSV and the area overheads are both dropped. Key words ：Three-Dimensional（3D ）; Through-Silicon-Vias（TSV ）; fault-tolerant 摘 要：三维（3-Dimensional ，3D ）电路由于其更高的密度、更高的传输速率及低功耗的优点逐渐受到人们的重 视和研究，而硅通孔（Through Silicon Via ，TSV ）技术是三维电路中互联上下层不同模块的主要方法之一。然 而由于制造工艺水平的限制，在芯片制作完成后会出现一些失效TSV ，这些失效TSV 会导致由其互联的模块 失效甚至整个芯片的失效。提出了一种多链式的硅通孔容错方案，通过将多个TSV 划分为一个TSV 链，多个 TSV 链复用冗余TSV 的方法修复失效TSV。通过相关实验显示，该方案在整体修复率达到90%以上的情况下 可以较大地减少冗余TSV 增加的个数和面积开销。 关键词：三维（3D ）；过硅通孔（TSV ）；容错 文章编号：1002-8331（2012 ）20-0075-06 文献标识码：A 中图分类号：TP391.7 1 引言