【SMT资料】BGA双球（枕头效应）原因分析及改善对策BGA soldering-Head in pillow知识分享.pptVIP

BGA Soldering-Head In Pillow;; Classification of BGA soldering failure mode;a. Void;g. de-wetting;Head-in-pillow;BGA assembly problem analysis;Void;Dewetting;Pillow;Case Study BGA Head-in-pillow defect issue; ;Component inspection ;SEM-EDS analysis;SEM-EDS analysis;SEM inspection;SEM inspection;;SMT reflow-Profile ;SMT reflow - Shenmao solder paste ;Cooling to 235℃;Cooling to 100℃;