【SMT资料】LF stencil design无铅工艺钢板设计规则PPT(42页)知识分享.pptVIP

Stencil Design Rule for Lead Free Process 模板设计规则无铅工艺;總表3: 3 of 3;注意事項:;D=PCB PAD size(mil);BGA(pcb pad=14mil) Stencil design formula: Stencil design size 1:1; BGA (pcb pad=12mil) Stencil design formula: Stencil design size 1:1;1.27 pitch QFP, SOIC, Connector Stencil design formula: Stencil design size = L*W mil L = PCB PAD length size(l) + 4 mil (外移 6 mil) W = PCB PAD width size(w) + 4 mil W = PCB PAD width size(w) + 12 mil(最外邊4 pin) ;1.27 pitch電感 為 IC 包裝 Stencil design formula: Stencil de