《单晶硅切割工艺装备设计》-毕业学术论文设计.docVIP

单晶硅切割工艺装备设计 摘 要 多线切割机是IC(集成电路)、IT(信息技术)、PV(光伏)等行业核心器件基片制造流程中的关键装备。多线切割是目前最先进的切片加工技术，其原理是通过金属线的高速往复运动把磨料带入待切割材料中进行研磨，将待切件同时切割为数百或数千片薄片的创新性切片工艺。但多线切割机制造技术难度大，其核心技术长期被瑞士、日本等国家的极少数公司所垄断，严重制约了我国半导体照明、光伏、集成电路制造等产业的发展。开发具有自主知识产权的多线切割技术及装备，已成为突破国外技术封锁和国内产业瓶颈的关键举措。 本文分析了多线切割机的工作原理和结构特点，在此基础上，主要对多线切割的机械设备及控制系统进行了设计。其次对影响多线切割效率的因素以及多线切割的微观机理进行了分析和总结。经过比照同类切割机以及查阅相关资料，确定了所设计多线切割机的主要技术参数与工艺参数，其设备设计主要内容包括：升降台工作系统设计|、主辊传动系统设计、收放线轮系统设计、排线系统设计、张力系统设计。 关键词：多线切割机，设备设计，张力系统，切割液 Monocrystalline silicon cutting process equipment design Abstract Many line cutting machine is IC (integrated circuit), IT (information technology), PV (photovoltaic) core device manufacturing industry such as substrate flow of the key equipment. Many line is the most advanced slice processing technology, the principle of which is through the metal line of high speed reciprocating movement into the abrasive materials for cutting of grinding, will stay cut into pieces and cutting for hundreds or thousands of thin slices of innovation slice process. But many line cutting mechanism, the technical difficulties made core technology has long Switzerland, Japan and other countries a monopoly of the company, which seriously restrict the semiconductor lighting in our country, and photovoltaic, integrated circuit manufacturing industry. Development with independent intellectual property rights of the many line cutting technology and equipment, and has become a breakthrough technology from abroad and domestic industry of the blockade key measures. Bottlenecks This paper analyzed the working principle of five-axis wedm machine and the structure characteristics, based on this, mainly to the many line of mechanical equipment and control system design. Next to influence the efficiency of the line and the linear factors microscopic mechanism were analyzed and summarized. After the same cutting machine and inspection according to related material, make sure the design line cutting machine more than the main technical pa