《BCB微图形化工艺研究》-毕业论文.doc

致谢 BCB微图形化工艺研究 摘要 微细加工技术是人类迄今为止所能达到的精度最高的加工技术之一，其加工尺寸已经达到深亚微米、百纳米、甚至纳米级，在当今技术领域已经具有举足轻重的地位。本文所讲的就是微加工一种工艺的实验研究。它是利用基于BCB的化学聚合物——CYCLOTENE牌先进电子学干法刻蚀树脂，作为牺牲层，进行图形化处理。本文主要描述对BCB利用旋涂和加热固化的方法形成厚度在几微米的薄膜，此薄膜可以用光刻及干法刻蚀的方法，进行图形化及去除。具体操作步骤为：先在硅片上均匀涂敷一层增附剂，再涂BCB膜层，对其进行自升温固化或进行快速热处理，然后再在BCB膜上均匀涂敷一层光刻胶，通过前烘、曝光、显影等工艺，再通过干法刻蚀在硅片上形成BCB图形。本文主要目的是通过大量实验，制备不同厚度的BCB薄膜，得到这些不同的BCB的成膜条件、图形化处理条件等。 关键词：BCB；微细加工；光刻；干法刻蚀 Study on BCB’s figure treatment technology Abstract The submicro processing technology is one of the precist manufacture technology that could be achieved today. The resulting size has reached to the micron more inferior deeply and hundred nanometer and even to the extent that the nanometer level now, it plays an important role in today’s technology field. What this text speaks is the experiment research which is one kind of method of submicro processing. It uses chemical polymer based on BCB – dry-etch CYCLOTENE advanced electronics resins as a sacrifice to go on figure treatment. This paper is chiefly described to the BCB and is used to spread soon and heats that the method solidifying forms thickness several microns to the film of tens microns, and this film can be used photolithograph and wet etching that the method graphization losing reaches to go to remove. The concrete operating sequence is: Coat one even layer of adhesion on the silicon chip first , and then a BCB membrane storey, and then carries on his certainly liter temperature solidification or carries on quick heat treatment, then coat a layer of photoresist evenly on BCB membrane, go on baking , exposing , developing etc. and then using dry-etch process to form BCB figure.The main purpose of this paper is to prepare BCB membrane of different thickness through a large number of experiments , to get the membrane condition , figure treatment　condition of these different BCBs. Keyword: BCB ; Submicro processing ;Photolithograph ;Etching 目录 TOC \o 1-3 \h \z \u HYPERLINK \l _Toc106774641 1绪论 PAGEREF _Toc1