《集成电路封装工艺》-毕业论文.docVIP

PAGE PAGE 3 集成电路封装工艺 摘 要 集成电路封装的目的,在于保护芯片不受或少受外界环境的影响,并为之提供一个发挥集成电路芯片功能的良好环境,以使之稳定,可靠,正常的完成电路功能.但是集成电路芯片封装只能限制而不能提高芯片的功能. 了解了以上内容，或许你大概还不是很清楚什么是封装技术。那么芯片封装技术又是什么呢？让我们来看下面的内容。 集成电路芯片封装是指利用膜技术及微细连接技术，将芯片及其它要素在框架或基板上布置、粘贴固定及连接，引出接线端子并通过可塑性绝缘介质灌封固定，构成整体立体结构的工艺。此概念称为狭义的封装。在更广的意义上讲的“封装”是指封装工程，是将封装体与基板连接固定，装配成完整的系统或电子机械设备，并确保整个系统综合性能的工程。上面两层封装的含义结合起来，构成了广义的封装概念。将基板技术、芯片封装体、分立器件等全部要素，按电子设备整机要求进行连接和装配，实现电子的、物理的功能，使之转变为适用于机械或系统的形式，成为整机装置或设备的工程称为电子封装工程。 本文介绍了封装测试工艺流程,详细介绍了CTL工艺流程及操作,为封装测试工艺提供了参考. 关键词: 芯片 封装测试 Abstract The purpose of IC package, is to protect the chip from the outside or less environmental impact, and provide a functional integrated circuit chip to play a good environment to make it stable and reliable, the completion of the normal circuit functions. However, IC chip package and not only restricted to enhance the function of the chip.  Understanding of the content of the above, perhaps you do not is very clear about what the packaging technology. Chip packaging technology then what is? Let us look at the contents of the following. IC chip package refers to the use of membrane technology and micro-connection technology, chips and other elements in the framework or substrate layout, paste fixed and connected to lead terminals through the plastic encapsulating dielectric constant, which constitute three-dimensional structure of the overall process . The concept of the package known as the narrow sense. In the broader sense of the package means packaging engineering, package body is connected with a fixed substrate, the assembly into a complete system or electronic machinery and equipment, and to ensure that the integrated performance of the whole system works. The meaning of the above two-tier package together constitute a generalized concept of the package. The substrate technology, chip packaging body, all of the elements such as discrete devices, in accordance with the requirements of electronic equipment to connect an