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- 约12.19万字
- 约 89页
- 2018-11-24 发布于江苏
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ABSTRACT
ABSTRACT
Rapid developments in high density and power chips have led to the
micro-electronics components with a serious heating problem. It will affect the
performance and reliability of chips, causes internal structure destroys, device
deformation and function failure et al. Under for this situation, thermal design has
become a key link to micro-electronic device st
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