低温烧结纳米银浆的制备材料加工工程专业论文.docxVIP

哈尔滨工业大学工学硕士学位论文 哈尔滨工业大学工学硕士学位论文 - - II - Abstract Thermal interface materials play an important role for the heat dissipation of integrated chips and other elements in electronic packaging. The heat-conducting property of traditional thermal interface materials such as thermally conductive adhesive and solder have not been competent, so that they have restricted the heat dissipation. Low-temperature sintered nanoscale silver paste which acts as a kind of thermal interface materials has high heat conducting property which the other thermal interface materials do not possess. However, this kind