高可靠厚膜功率组件低空洞烧结设计与工艺技术研究-电子与通信工程专业论文.docxVIP

北华航天工业学院硕士学位论文 高可靠厚膜功率组件低空洞烧结设计与工艺技术研究 摘 要 在当今电子工业高速发展的时代，随着厚膜混合集成电路向着高性能、高可靠、小 型化、高均一性及低成本方向的发展，对厚膜混合电路的组装技术和工艺提出了越来越 高的要求。在厚膜混合集成电路中，功率组件是核心器件，决定着厚膜功率组件的性能 和热响应情况。在厚膜功率组件的组装中，现在主要存在的问题是：由于焊接的器件空 洞较多，所以工作时产生的热量不能有效地发散，最终使器件的工作结温高，降低了其 使用寿命，甚至个别零件由于温度较高而导致电压击穿。 影响空洞产生的因素有很多，本文经过查阅大量的文献，结合国内外发展现状，分 别从厚膜管壳、基板的尺寸；焊料成分、状态（焊片、焊膏）的选用；工艺曲线（真空 度、还原气氛、温度设置）各个方面来减小孔洞率，其后通过外观、X 射线、金相分析、 剪切力测试分析厚膜功率器件的孔洞率、可靠性，找出形成空洞的真正原因是焊料在烧 结过程中残留的气体和氧化物无法排出。结果表明：回流焊中通过对工艺温度曲线、焊 接层厚度、压力的分析，找到了各自合适的参数改善焊接空洞问题。得出温度曲线是影 响焊接空洞大小的最显著因素，真空焊通过对工艺曲线、压力、甲酸的控制、载体粗糙 度、气氛保护的分析，找到了各自合适的参数改善焊接空洞问题，得出工艺曲线、气氛 保护是影响焊接空洞大小的最显著因素。 关键字：高可靠厚膜功率组件 烧结 空洞 回流焊 真空焊 I  PAGE 2 Abstract In todays era of rapid development of the electronics industry, with the development of thick film hybrid integrated circuit towards high performance, high reliability, miniaturization, high uniformity and low cost direction, put forward higher requirements of thick film hybrid circuit assembly technology and process. In the thick film hybrid integrated circuit, power module is the core device, determines the response of thick film component properties and thermal power. In the assembly of thick film power components, now the main problem is: the welding device more empty, so the heat generated when the work can not be effectively divergent, eventually make the device junction temperature is high, reducing its service life,and even individual parts due to voltage breakdown due to high temperature. There are many factors affecting the voids, through the literature, combined with thedevelopment status at home and abroad, respectively from the shell, thick film substrate size;solder composition, state (pad, solder) selection; process curve (vacuum, reducing atmosphere, temperature setting) to reduce all aspects of small hole rate, then, by the appearance of X ray, metallographic analysis, shear stress test analysis of thick film power devices, the reliability of the hole rate, find out the real reason for the formation of empty sol