AuSn共合金无氰共沉积镀液及工艺优化.docx

优秀毕业论文 精品参考文献资料 Au—Sn共晶合金无氰共沉积镀液及工艺优化 -————_-————————————————————————————————————————————一 Optimization of non-cyanide CO—deposition solution and process of Au-Sn eutectic alloy Abstract Au-30at．％Sn eutectic solder has high strength,good wettability,high thermal conductivity,high creep resistance，good thermal fatigue resistance and other advantages． That make it very suitable for high-reliability packages，especially．in the high-power LED flip chip package．Compared to the non-phted preparation method of Au--30 at．％Sn eutectic sober bump，the phting method is low cost,simple process，high degree ofconsistency and SO on．But the study of non-cyanide phting bath is difficult,especially in the bath stability． Therefore a ITDre stable bath is prepared in this paper and the effect ofbath composition and pating parameters on the coatingswas studied systematically。At hts the Au-30at％Sn eutectic solder was obtained after bath composition and pating pamn℃ters opthfization． The main conchsiom of this paper are as follows： (1)The plating bath consitited of Au(DMH)4‘，sodium sulfite，ammonium citrate． stannous pyrophosphate，potassium pyrophosphate and catechol，gold ions and starmum(II) ions has been蜘ly complexed．Thus the bath is more stable，it remains colorless at a relatively high temperature during plating and placed for marly 20 days at room temperature 妯no precipitate． (2)In the bath components：Catechol can improve the quality ofcoat吨S and has a great effect on tiIl content ofthe coating the suitable concentration is between O．02 M and O．04 M． Sn2+comentration has great effect on the coating surface morphology and composition and it plays a vital role on Sn content,the suitable Sn2+concentration should be 0．02 M(the Sn2+to Au iom corr．entration ratio should be 2)．sodium sulfite concentration had no effect on morphobgy and composition of the coatings，then sodium sulfite concentration can greater than or equal to 0．1 2 M(the sodium sulfite to Au ions concentration rat