基于ANSYSWorkbench半导体激光器封装热特性分析.PDFVIP

Modern Physics 现代物理, 2018, 8(4), 232-238 Published Online July 2018 in Hans. /journal/mp /10.12677/mp.2018.84025 Analysis of Thermal Characteristics of Semiconductor Laser Packaging Based on ANSYS Workbench * Weidong Cao, Yuan Feng , Changling Yan, Yongqin Hao, Yang Li, Hao Yan, Jiabin Zhang, Huimin Jia, Yinzhen Wu Changchun University of Science and Technology, Changchun Jilin th th th Received: Jul. 4 , 2018; accepted: Jul. 18 , 2018; published: Jul. 25 , 2018 Abstract Based on the theoretical analysis of the thermal characteristics of semiconductor lasers, the model of c-mount packaging is established by using ANSYS Workbench software. The temperature and heat flux distribution of single-tube semiconductor laser chips are simulated and analyzed. When the output power is 10 w, the temperature of traditional c-mount packaging chips is 66.393˚C, and thermal resistance is 4.6 k/w. By adding a layer of graphene with high thermal conductivity be- tween the heat sink and the laser chip, the heat flux diffusion area is increased; the temperature of the chip is reduced to 55.587˚C; the thermal resistance is 3.5 k/w; and the heat dissipation effect is obvious. The maximum output power is increased from 15.4 w to 18.5 w. It is found that the out- put power is increased by 20%. Keywords Semiconductor Lasers, ANSYS Workbench, C-Mount, Graphene 基于ANSYS Workbench半导体激光器封装热 特性分析 * 曹伟冬，冯 源 ，晏长岭，郝永芹，李 洋，闫 昊，张家斌，贾慧民，吴胤禛 长春理工大学，吉林 长春 收稿日期：2018年7月4 日；录用日期：2018年7月18 日；发布日期：2018年7月25 日 *通讯作者。 文章引用: 曹伟冬, 冯源, 晏长岭, 郝永芹, 李洋, 闫昊, 张家斌, 贾慧民, 吴胤禛. 基于 ANSYS Workbench 半导体激 光器封装热特性分析[J]. 现代物理,