光电子材料的磨粒加工技术综述.pdfVIP

21 6 超　硬　材　料　工　程 Vol. 21 2009 12 SUPERHARD MATERIAL ENGINEERING Dec. 2009 ¹ , ( , 362021) : 随着通讯、信息产业的迅速发展, 各种光电子元件得到惊人的发展并趋于高性能 , 对光电子材料 的加工技术也提出了更高的要求。文章从锯切、磨削、抛光三 个方面介绍了光电子材料的磨粒加工技术,并 对光电子材料磨粒加工技术的发展趋势进行了展望。 : 超硬材料工具; 光电子材料;磨粒加工技术 : 164: : 1673- 1433( 2009)06- 0036- 06 T A Abrasive machining technology of optoelectronic materials - , - ZHU Huo ming SU Zhen fa (Colleg e of M echan ical E ng ineer ing and A utomat ion, H uaqiao Univ er sity , Quanz hou , F uj ian 362021) Abstract :With the rapid development of communication and information industries, vari- ous optoelectronic elements which are tend to be high performance are stupendous pro- gressed The higher performance of machining technology is required to meet those de-. mands. In this paper, the machining technologies for the optoelectronic materials are in- troduced from three aspects, sawing, grinding and polishing. T he prospects of abrasive machining technology are looked forward. Keywords: superhard abrasive tool; optoelectronic materials; abrasive machining technol- ogy 1 , ; ,{012}; , , , , ,, : ( 1) : : ( 1) ; ( 2) ( 6.5) , ; ( 3) , , ,