基于ic封装的并联焊头机构的设计与优化-机械电子工程专业论文.docxVIP

耋童三些奎兰三兰至圭篁兰ABSTRACT 耋童三些奎兰三兰至圭篁兰 ABSTRACT The IC chip encapsulation equipment which is composed of precision mechanical structure，electric control，image identify and photoelectricity detection parts and so on includes the execute implement and the sensor which can apperceiVe and control the outside imformation，which fully displays the multil一subjects frontier’s hi曲synthesis and osmosis．Currently，how to ulteriorly heightens these equipments’ speed and precision，especially enhances its performance under the condition of high—speed moving is the hotspot of the domestic and international research deVelopment． The research is from techon0109ical project of Guangzhou city(200423一D902 1)： Research of Basing on IC encapsulation with parallel mechanism． This text designs and develops the Bonding Head for the IC chip die—bonder with parallel mechanism，sets up the optimized·model， and sets up the optimized—model for running distance of right slider crank and the wh01e length of sljder track． Basing on the optimized result，the model of Bonding Head for the IC chip die．bonder with parallel mechanism will be made out．Setting up the equatjon of kinematics，by analyzing and solving kinematics equation with positiVe solution and negative solution，motion rules of the bonding head and driVe point are obtained，and by using example to verify these rules．In cOntr01 part，the motion contr01 system for parallel mechanism is designed， and those questions that the principle and use of motion control card and servo motor are discussed．To use C language to programme of contr01．and to contr01 the motion svstem under the circumstance of DOS．And how to use the control interface．are also discussed． By designing and developing Parallel Plane Mechanism，and researching its work principle，the struc【ure，parameters of IC encapsulation key machine，relatiVe data，curves，graphs can be obtained，which forms some rules and theo ries．Guiding the structure design and application of IC encapsulation machine． The