面向ic封装的气浮定位平台的研究-机械制造及自动化专业论文.docxVIP

优秀毕业论文 精品参考文献资料 研究生优秀毕业论文 The The Investigation of Float Positioning Platform for IC packaging Discipline：Mechanical Manufacturing and Automation 跏妇倒gnature：2h跏叶 Supervisor Signature： h扒酋。 Abstract With the fast development of semiconductor manufacturing technology,continual increase of chip integrated level and number of pins，and decrease of distance between pitches，which leads it necessary to improve the speed and the stability．This paper presents a new 2-DOF positioning platform drove by linear motoE This dissertation deals witll the key issues relevant to structural design,static and dynamic characteristics and dynamic modeling by means of finite element method and mechanical dynamics．As a resuilt，a test platform has been developed to validate the effectiveness of the resuilt．The main achievement are as follows： Firstly,a generalized parallel aerostatic positioning stage directly driven by linear motor is designed according to the requirements of the positioning stage for packaging equipment．The 3一D model is built by using parameterized modeling methods of Soildworks．Through modifying the structure feature of the 3一D parts，the spatial layom of the mechanism is made appropriately to meet their assembling and manufacturing requirements．Furthermore，the designing parameters are optimized through static and dynamics analysis using the finite element software ANSYS．which makes the deformation of the efficient surfaces of aerostatic guideways less than 0．1 lam．Based on the results，the dynamic structural design of the XY table has been implemented． secondly,In the MATLAB software environment，according to Reynolds equations and gas flow conservation law．The characteristics of the positioning platform flotation and flotation of the drive mechanism are being studied．And the bearing capacity of the flotation positioning platform，air-driven organization by carrying when partial load were analyzed to calculate the force 万方数据 Finally,based Finally,based on the above re