单晶硅片的表面织构化与应用电子与通信工程专业论文.docxVIP

单晶硅片的表面织构化与应用电子与通信工程专业论文.docx

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单晶硅片的表面织构化与应用电子与通信工程专业论文

APPLICATION APPLICATION AND SURFACE TEXTURIZATl0N OF MONOCRYSTALLD旺:SILICON WAFERS ABSTRACT At present,crystalline silicon solar cells still hold a dominant position in photovoltaic power generation.Moreover,the monocrystalline s ilicon solar cells occupy a certain market share,because of its high photoelectric conversion efficiency, long service life,cost reduction and other advantages.The photoelectric conversion efficiency of silicon solar cells Can reach about 20%in the industry.This paper used a new monocrystalline silicon wafers cut by diamond wire as the research object, and adopted a s叩e—or alkaline solution with low cost to proceed the surface texture. This paper compared monocrystalline silicon wafers cut by diamond wire with traditional monocrystalline s ilicon wafers cut by mortar,discussed the influence of alkaline solution in tWO kinds of cut process of monocrystalline silicon wafers,and analysed the samples’surface morphology,reflectivity,and the performance of solar cell after the surface texture.The results shows that the surface damage hyer thickness of monocrystalline silicon wafers cut by diamond wire is on矽3-5 Bin, lower than the monocrystalline silicon wafers cut by mortar(12—17 mn),illustrating that diamond wire cutting process Can e虢c咖ely reduce the loss of silicon material- Under the condition of center wavelength of 650 rlln,the original monocrystalline silicon wafers cut by diamond wire has a high reflectivity of 42.3 6%.however,the reflectivity of the original monocrystalline silicon wafers Cut by mortar is only 30.63%.Using alkaline solution to proceed surface texture to the original s ilicon wafers which obtained by tWO different process can effectively reduce the surface Ⅱ 万方数据 内蒙古大学硕士学位论文reflectivity.After 内蒙古大学硕士学位论文 reflectivity.After surface texture,the surface reflectivity of monocrystalline silicon wafers cut by dialnond wire is only 10.80%,apparently lower than the surface reflectivity of monocrystalline silicon wafers cut by m

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