低温对无铅焊料组织和性能的影响材料加工工程专业论文.docxVIP

广东工业大学硕士学位论文的焊点剪切断裂面都在焊料上，表现为塑性断裂，经一20℃以及一80℃冷藏后的焊点剪 广东工业大学硕士学位论文 的焊点剪切断裂面都在焊料上，表现为塑性断裂，经一20℃以及一80℃冷藏后的焊点剪 切断裂方式均为脆性断裂：此外，焊丝的电导率随着储存温度的降低呈波浪起伏变化； 焊料密度在一80℃的冷藏温度下达到最大；随着时效时间的增加而Cu3Sn(s)相层不断变 厚，Cu6Sn5相层的厚度随着时效时间的延长呈先升高，后降低，再升高的趋势；通过 XRD分析，焊料主要由B—Sn、A93Sn两相构成，未能在合金中检测出Ag、Cu单质。 对于SnSM．5Cul．5Ni无铅焊料而言，其铸态焊料的抗拉强度随着储存温度的降低 而降低，在一20℃时最小；延伸率随储存温度的降低逐渐提高，当储存温度为．10。C时， 延伸率最大，达到33．51％；SnSM．5Cul．5Ni／Cu焊接接头的抗拉强度和剪切强度都随 着储存温度的降低而直线下降；在焊接接头拉伸实验中，随着冷藏温度的降低，断裂 面位置分别在焊料以及中间化合物、焊料／Cu6Sn5、焊料／Cu6Sn5、金属间化合物Cu3Sn， 断裂方式由韧性断裂向脆性断裂过渡；随着冷储存温度的降低，焊点剪切断裂方式由 塑形向脆性转变；同时，焊丝电导率随着储存温度的降低呈现直线上升现象；焊丝密 度随着储存温度的升高而降低，在4。C时最小；经XRD分析，焊料主要由13．Sn和化 合物SnSb、单质Sb三相构成，并未发现Cu、Ni相，合金在低温储存中，未发生晶 格畸变。 关键词：低温；无铅；焊料；组织；性能 Ⅱ 万方数据 AbstractAbstract Abstract Abstract In today’S rich，colorful and updating world，electronic products have already become part of our life，we can see people use electronic products here and there，such as MP3， cellphones，computers and ipad etc．Solder,as an indispensable material of electronic packaging，research of its function gets attention from researchers all over the world．Sn．Pb solder is widely used in the electronic packaging industry because of its low cost，low melting point，good spreadability and easy operating．HoweveL people attach more and more importance to the bad effects on environment and health from products which have Pb，every country has already enacted laws which leaded solder is forbidden to use． With the achievement of high density packaging and diversity of environment， environment of electronic instruments and equipments’temperatures becomes more and more harsh，SO it also has higher demand on electronic products’reliability under extremely low temperature condition．Therefore，research on unleaded solder’S reliability under low temperature Can not be ignored and is a potential problem in packaging technology engineering． SnA93．0Cu0．5 unleaded solder and solder wire and SnA93．0Cu0．5／Cu welded joint were prepared at the state of the casting and Cu，Ni elements were added in the ba