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IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, VOL. 24, NO. 2, JUNE 2001 159
Optimization of Plate Fin Heat Sinks Using Entropy
Generation Minimization
J. Richard Culham, Member, IEEE, and Yuri S. Muzychka
Abstract— The specification and design of heat sinks for elec- Fin length in m.
tronic applications is not easily accomplished through the use of Dimensionless fin length.
co
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