铜电化学沉积在微孔金属化中的应用-物理化学学报.PDFVIP

物理化学学报(Wuli Huaxue Xuebao) September Acta Phys. -Chim. Sin. 2011, 27 (9), 2135-2140 2135 [Article] 铜电化学沉积在微孔金属化中的应用 杨防祖* 吴伟刚 田中群 周绍民 (厦门大学化学化工学院, 固体表面物理化学国家重点实验室, 福建厦门361005) 摘要: 以分布有微孔的印刷线路板(PCB)作为模板, 按照PCB 孔金属化工艺路线, 研究乙醛酸化学镀铜和柠 檬酸盐体系铜电沉积工艺在PCB 微孔金属化中的应用. 结果表明, 乙醛酸化学镀铜和柠檬酸盐体系电沉积铜 可以成功地应用于PCB 微孔金属化加工工艺中. 微孔化学镀铜金属化导电处理后, 铜附着于微孔内壁, 颗粒细 小, 但排列疏松且局部区域发生漏镀现象. 微孔一经电镀铜加厚, 镀层电阻显著下降; 孔壁内外的铜沉积速率达 到0.8:1.0; 铜颗粒具有一定的侧向生长能力, 能够完全覆盖化学镀铜时产生的微小漏镀区域; 微孔内壁铜镀层 连续、结构致密并紧密附着于内壁, 大大增强了PCB 上下层互连的导电性能. 关键词: 微孔; 化学镀铜; 电沉积铜; 金属化; 印刷线路板 中图分类号: O646 Application of Copper Electrochemical Deposition for the Metallization of Micropores YANG Fang-Zu* WU Wei-Gang TIAN Zhong-Qun ZHOU Shao-Min (College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Province, P. R. China) Abstract: According to established routes for the microporous metallization of printed circuit boards (PCB), electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath were used for microporous metallization with PCB distributing micropores as a template. The results show that electroless copper plating using glyoxylic acid as a reducing agent and copper electroplating in a citrate bath can be successfully applied to the microporous metallization of PCB. After an electric conducting treatme