附表一-十七项半导体晶圆制造设备.docVIP

附表一 ???????????????????????????????????????????????????????? 十七項半導體晶圓製造設備 項次 貨名 商品分類號列C.C.C.Code 1 供半導體晶圓製程用之磨光、拋光及研磨機器 Grinding, polishing and lapping machines for processing of semiconductor wafers 8486.10.00.20-1 2 生產半導體用化學氣相沈積器具 Chemical vapor deposition apparatus for semiconductor production 8486.20.00.11-0 3 製造半導體用之物理氣相沈積器具 Physical deposition apparatus for semiconductor production 8486.20.00.12-9 4 供半導體材料乾式蝕刻圖形用工具機 Machine-tools for dry-etching patterns on semiconductor materials 8486.20.00.31-6 5 供蝕刻、去除光阻物或清洗半導體晶圓之噴灑機具 Spraying appliances for etching, stripping or