桌上型相移式阴影叠纹系统之开发.doc

桌上型相移式陰影疊紋系統之開發 The Development of an Automatic Desktop Phase-Shifting Shadow Moiré System 研究生：吳時賢 Wu, Shih-Hsien 指導教授：林宜弘 Lin, Yi-Hong 【摘要】 BGA型電子構裝在製程中常因其內部各層間熱膨脹係數不同或製程參數不佳，造成其表面翹曲之現象發生。目前業界對於此種翹曲之檢測多採用逐點量測法，且以抽檢之方式進行，使得產品之品質無法獲得全面性之掌握。因此，發展一套線上全面檢測系統，便成為當務之急。 本研究特別針對此一問題，開發一套桌上型BGA電子構裝表面翹曲線上量測系統，以量測BGA電子構裝之翹曲量。首先，先利用陰影疊紋法為基礎，搭配自行設計之平行光光源，以減少量測之誤差量。爲了增加系統解析度，於是導入四步相移技術，並以伺服馬達搭配光學尺來達到精密位移之需求。接著，導入數位影像相位展開法將被切割的相位予以還原；數位影像相位展開法部分是依影像前處理、圖像物體辨識及決策反應之順序，對含有雜訊之相位圖進行相位展開。最後，針對工作現場之環境，設計一處理速度快、架設容易、穩定性高及操作容易之線上檢測機構。 關鍵字：BGA、翹曲、陰影疊紋法、項位展開、數位影像處理 【Abstract】 One of the main factors makes the warpage of the BGA electronic packages is the difference of thermal expansion coefficient between materials. A laser point-to-point measuring method is primary used to measure the warpage now by off-line sampling inspection. Nevertheless, we can’t control the product’s quality very well in the manufacturing process. Therefore, it is important to establish an on-line inspect system to measure the warpage of the BGA. The purpose of the thesis is to develop a desktop on-line auto-inspection warpage system for BGA electronic packages. A shadow moiré technique combined with self-designed illuminate module to reduce the error of the system, and used four-step phase shifting technology to improve the resolution of the shadow moiré pattern. Then, the uncontinued phase field was restored by unwrapping technology based on the digital image processes. The digital image unwrapping technology unwrap a noise phase map effectively by the following steps. The processing sequences are Segmentation, Image Preprocessing, Pattern Recognition and Decision. Finally, the developed system can provide a high-speed, easy-setup, easy-use and high-stability mechanism for applying in on-line production processes. Keywords：BGA, warpage, shadow moire, phase unwrap, digital image processing