一种使用在基于单元库布局布线流程的芯片上变异(OCV)监控器方法学.docVIP

一种使用在基于单元库布局布线流程的芯片上变异 (OCV) 监 控器方法学 摘要:工艺参数的变异导致半导体制造过程的偏差。 这 种变异无法避免而且在深亚微米领域 ,受限于光刻分辨率 ;氧 化层腐蚀造成厚度的改变 ,因化学机械抛光铜金属线使铜金 属层所造成的不平坦碟型缺陷等种种因素变得更加严重。除 了工艺上的变异之外 , 电源电压以及操作温度也可能造成芯 片上变异。这些芯片上变异通常建模为预估电路性能的某个 百分比。 环形振荡器在芯片上变异监控器中 ,被最广泛地作为性 能指标。 在过去 ,一般要花一到两周利用全手工定制对每个不 同的工艺节点来实现工艺监控器的布局。然后 , 我们也必须 手工将监控器单元放入芯片。这样做总是增加芯片实现上的 开发周期。 在本文将会提出一种实用的方法学来集成芯片上变异 监控器 , 包括如何在一般基于单元库布局布线流程里来实现 变异监控器 , 以及一种在逻辑阶段或物理实现阶段基于单元 库灵活的整合流程来减低实现时所花费的精力。 关键词 :布局布线流程 ;芯片变异监控器 ;环形振荡器 ;晶 圆测试 ;量产测试 ;自适应电压与频率调节 ;静态时序分 析;IDDQ 测试 An On-Chip Variation Monitor Methodology Using Cell-Based PR Flow HUNG Yu-ting,Tsai Yu-Wen,CHEN Hung-ming (Faraday Technology China Corp.,Shanghai,200233 China) Abstract: The process variation accounts for deviations in the semiconductor fabrication process. This variation becomes unavoidable and serious in the deep submicron era due to limited lithographic resolution, a variety of oxide thickness, dishing and erosion effect on copper metal layer, and so on. In addition to process variation, supply power and operating temperature are also possible on-chip variances.Usually these on-chip variations are modeled as a percentage variation in the circuit performance estimation. The ring-oscillator is the most widely used as performance meter in the on-chip variation monitor. In the past, it would take 1 or 2 weeks to implement process monitor layout by fully-customer layout service for each different process technology. After that, we also have to place the monitor cells into chip manually. It increases the implementation turn around time. In this paper, a practical integrated on-chip variation monitor methodology is proposed, including variation monitor implementation in cell-based PR flow, and a flexible cell-based integration flow in logic level and physical level to reduce the implementation effort. Keywords: Place and Route Flow; On-Chip Variation Monitor; ring-oscillator;circuit probe;final test;Adaptive V oltage and Frequency Scaling;Static Timing Analysis; IDDQ Test 1 使用一