硅基微纳光学阵列元件的约束刻蚀加工研究-材料物理与化学专业论文.docxVIP

南昌航 南昌航空大学硕士学位论文 摘要 万方数据 万方数据 获得亚微米级的分辨率。经过后续工作的进一步优化，有望获得更高的刻蚀加工 分辨率，体现了 CELT 广阔的应用前景。 关键词：约束刻蚀剂层技术，微加工，半导体，微光学阵列元件，电化学加工 II 南昌航 南昌航空大学硕士学位论文 ABSTRACT ABSTRACT With the rapid development of micro electromechanical systems (MEMS) today， miniaturization，integration and intelligence have become the most important trends in science and technology. Microsystems will become one of the most challenging fields of science and technology in 21st century. And it will lead to a huge breakthrough on human’s ability to understand and reconstruct the world. Recently, as a newly emerging high-tech ， the use of electrochemical machining method for fabricating micro/nano structures has become one of the remarkable and great potential technological advances. Electrochemical micro/nano machining methods have great potentials in the machining of complex 3D micro/nano structures ， due to their advantages of wide range of materials machined，stress-free，high surface quality， low environmental requirements，high resolution and low cost and so on. The Confined Etchant Layer Technique (CELT) (first proposed by prof. Zhao-Wu Tian in 1992) is a new machining method for micro/nano structures. This method has good comprehensive advantages for: (1) Micrometer or nanometer scale resolution can be reached, (2) Replication of the real 3D complex structures can be realized, (3) Mass production of micro/nano structures can be achieved simultaneously, which is unmatched among the traditional micro/nano fabrication technologies. In this paper ， CELT was studied to apply to fabricate 3D micromachining on the surface of the semiconductor Si wafer. Finally，a 3D microlens array has been successfully transferred onto the surface of Si wafer by the PMMA/Ti/Pt microlens array mold with the resolution of submicron level. The main conclusions of this work is described as follow： 1、The etchant and the scavenger which could be effective to etch Si were sought out and studied by electroche