封装与散热设计ThermalD.esignConsiderations.pdfVIP

CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6 - 2 Thermal resistance 6 - 2 Junction temperature 6 - 2 Factors affecting R th(j-a) 6 - 2 Thermal resistance test methods 6 - 3 Test procedure 6 - 3 Forced air factors for thermal resistance 6 - 4 Thermal resistance data - assumptions and precautions 6 - 5 Thermal resistance (R th(j-a) ) data 6 - 6 Thermal resistance (R th(j-c) ) data tables - power packages 6 - 24 Philips Semiconductors IC Packages Thermal design considerations Chapter 6 INTRODUCTION FACTORS AFFECTING R th(j-a) The ability to describe the thermal performance There are several factors which affect the characteristic characteristics of a semiconductor IC package is thermal resistance of IC packages. Some of the more becoming increasingly crucial. With increased power significant of these include the test board configuration, densities, improved r