芯片封装资料文档.pptVIP

前沿讲座 研究生教育 研究生教育 前沿讲座 湖南工业大学计算机与通信学院前沿讲座Lecture 1 集成电路封装技术-多芯片封装 陈卫兵 Spring 2012 前沿讲座 Slide * Outline 芯片封装发展史 芯片封装 LED封装 芯片封装发展史 The transistor invented at Bell lab. in 1947 前沿讲座 Slide * 芯片封装发展史 September 12th 1958, Jack Kilby at Texas instrument had built a simple oscillator IC with five integrated components (resistors, capacitors, distributed capacitors and transistors) 前沿讲座 Slide * 芯片封装发展史 1959 - Planar technology invented 前沿讲座 Slide * 芯片封装发展史 1960 - Epitaxial deposition developed Bell Labs developed the technique of Epitaxial Deposition 1960 - First MOSFET fabricated Kahng at Bell Labs fabricates the first MOSFET. 1961 - First commercial ICs Fairchild and Texas Instruments both introduce commercial ICs. 1962 - Transistor-Transistor Logic invented 1962 - Semiconductor industry surpasses $1-billion in sales 1963 - First MOS IC,CMOS process invented RCA produces the first PMOS IC. 前沿讲座 Slide * 芯片封装发展史 前沿讲座 Slide * 前沿讲座 Slide * 芯片封装发展史 国内封装厂：江苏长电、天水华天、日月光、矽品、华泰等 合资封装厂：日立、三星、南通富士通等 国外封装厂：Intel、AMD等 前沿讲座 Slide * 针脚式 SMT 新一代 前沿讲座 Slide * 芯片封装 芯片封装 从芯片电学连接电源和信号到板上 要求有小的信号延迟和失真 机械连接芯片到板上 将芯片产生的热量耗散出去 保护芯片不被机械、应力毁坏 芯片和板的热膨胀系数兼容，防止芯片被热应力损坏 制造和测试费用便宜 前沿讲座 Slide * 芯片封装（邦定） Traditionally, chip is surrounded by pad frame Metal pads on 100 – 200 mm pitch Gold bond wires attach pads to package Lead frame distributes signals in package Metal heat spreader helps with cooling 芯片封装（邦定） Two methods 前沿讲座 Slide * 前沿讲座 Slide * 芯片封装（结构形式） 过孔和表面贴装形式 前沿讲座 Slide * 芯片封装（高级模式） Bond wires contribute parasitic inductance Fancy packages have many signal, power layers Like tiny printed circuit boards Flip-chip places connections across surface of die rather than around periphery Top level metal pads covered with solder balls Chip flips upside down Carefully aligned to package (done blind!) Heated to melt balls Also called C4 (Controlled Collapse Chip Connection) CSP模式 前沿讲座 Slide * ?Wrist Camera (Fujitsu) ?G-SHOCK Watch (IEP) 75% down-size mounting area 27mm 30mm Wire-bonding WLC