应用新型主发光体系统之高效率红色掺杂型有机电激发光元件.pptVIP

Applied by different generations of solar cells, plasma equipment Solar cell classification Applications of plasma devices Plasma coating membranes 2004 2020 The first generation Silicon type PECVD、Etcher Antireflection film batch coated 93% 50% Second-generation Film-type(Silicon、II-VI、III-V) PECVD、PVD Transparent conductive film, the metal electrode, the silicon thin film 7% 42% Third-generation Nano, organic, dye PVD、PECVD SiNx/SiOx film、Transparent conductive filmTiO2/Ta2O5、Metal electrodes 0% 8% * Thin film growth Chip?film,?the initial?covered?on?the?wafer surface,?many?gas molecules?or other child,?such?as?atoms?and?ions.?These particles?may?be?because?the? chemical reaction,?the?solid?particles, and then?deposited?on?the?wafer surface;?or?lose part?of?the kinetic energy?through?a?surface diffusion? campaign,?the?wafer surface?adsorbed?(absorbed)?were deposited.?According to?the?order of occurrence?can be divided into?the following five?steps (a)?crystal growth?(b) the?grain growth?and (c)?grain?coalescence? (d)?seam?Road?to?fill?the?(e) The deposition film?growth. * thin film deposition steps (a)?crystal growth?(b)?grain growth?and (c)?grain?coalescence (get together)?(d) The?seam Road?to?fill?the gap?(e) The?deposition?film?growth(1)?physical?adsorption on?the wafer surface?adatom(2)?adatom?back to?the?gas phase?by?absorption?of?the?solution * Thin film structure island structure： In the deposition, when the atoms or molecules are mutually binding capacity than the substrate strong island structure, such as metal insulator, graphite and other substrates. layer structure ： As?the?atoms?and?the substrate?bonding?is stronger?than the others.?The first layer of?coverage?completed?with?the second layer?of?bonding?will?be?weak,?such as semiconductor?thin film?of?single crystal?growth. Stranski-Krastanov(S.K.) structure ： Do?the aforementioned?model?of?an?intermediate process,?the current study?such behavior?is not?fully understood, there?