- 1、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。。
- 2、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 3、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
查看更多
视睿研华技术交流会议 --- 设计确保稳固质量行程表;板卡设计理念和流程 --- 确保稳固质量;设计 = 工具X规范/流程X KnowHow;工具;规范;设计流程1;设计流程2;Knowhow;品质 = 设计X验证;1、Power quality电源品质量测。;A+TC 验证项目;Thermal设计理念和流程 --- 确保稳固质量;Thermal Design Validation Flow;
Thermal design for rackmount/wall-mount/pedestal chassis.
Thermal simulation through Flotherm.
Collaborate with ME/EE function teams to define the system thermal profile.
Collaborate with industrial leaders to provide component level solutions to fulfill the system needs.
Early thermal design to come up with cost-effective solutions for system.
Thermal validation tests in EVT and DVT stages.
Collaborations with companies with new technologies. ;16;Work out system thermal requirement base on thermal simulation result
Define system cooling methods such as natural convection, force convection, air cooling, heatpipe cooling…etc.
Select cooling fan to provide sufficient air flow, air pressure, and review ball bearing (MTBF concern) spec, acoustic limitation for system requirement.
Define heatsink material (copper or aluminum), fins numbers, dimension, kinds of fin (stacked fin, insert fin, crimped fin, skiving fin…)
Decide venting hole spec, venting ratio and location on chassis.
Design airflow d/quantity/path efficiency to optimize system cooling
Thermal solution cost estimation
Reduce temperature inside system and impedance
Define HDDs gap, chipset heatsink selection, PSU fan support system cooling issue..;Conduction
Convection
Radiation
Vaporization
;Define thermal sensor location to monitor the ambient temperature and base on it to setup BIOS/IPMI for controlling the system/cooler fan to Optimized Acoustic and Thermal Performance;Step1: Set thermocouples on main components CPU, Heatsink, NB, SB, ODD, HDD, PSU inlet/outlet and reference area to collect the data.;Step2: Run tests in thermal chamber base on test plan and utilize software (Maxpower, WinBench…) to stress the system @ 35~
您可能关注的文档
最近下载
- 钍矿石选矿在线检测技术:原理、应用与展望.docx VIP
- 经营企划-经营计划与预算管理课件资料.ppt VIP
- [宜宾]2024年四川宜宾工业职业技术学院(筹)招聘员额制工作人员5人笔试历年参考题库附带答案详解.docx
- 《AI+新媒体运营》全套教学课件.pptx
- 部编版小学语文五年级上册期中复习课件(四单元全).pptx VIP
- 前厅服务员中级理论模拟题379道.doc VIP
- 新媒体营销:营销方式+推广技巧+案例实训(微课版)PPT全套完整教学课件.pptx
- 【部编版】小学五年级语文上册期中复习ppt课件【完整版】.pdf VIP
- 中国居民投资理财行为调研报告(2024年12月)-上海高金&蚂蚁集团.pdf
- 旧设备评估报告模板.docx VIP
原创力文档


文档评论(0)