论文--无氰高密度碱性镀铜的应用现状和前景.docVIP

无氰高密度碱性镀铜的应用现状和前景 摘要：介绍了SF-8639无氰高密度铜和SF-638无氰碱铜工艺在汽车铝轮毂电镀领域代替预镀哑镍和在五金钢铁零件电镀中代替氰化预镀铜的应用状况。与传统工艺相比，具有减排和降低制造成本的作用，并对比了与国外同类技术和常用预镀工艺(预镀哑镍、氰化预镀铜)的检测结果。通过两年多的生产中试和一年多的生产应用，证明了该工艺在卫浴锌合金件电镀中代替氰化预镀铜和焦磷酸盐镀铜的可行性。其流程更短，减少了设备、水电等投资，可同时达到节水和含铜废水减排的目的。最后，阐述了其在电子、可穿戴设备等行业的柔性印刷线路板(FPC)和具有导电功能薄膜组件电镀的应用前景。 关键词：无氰高密度铜；无氰碱铜；清洁生产 中图分类号：TQ153.1 文献标志码：B 文章编号： Application and development prospect of cyanide-free alkaline copper electroplating// SHANGGUAN Wen-long*, ZHAN Yi-teng, TIAN Zhi-bin, CHEN Wei-su, WANG Kai Abstract: The current application of cyanide-free processes for copper electroplating, substituting pre-plating of dumb-nickel plating used on automobile weels made of aluminum alloy and cyanide Cu pre-plating used on hardware made of steel, was introduced. Compared with the traditional processes, the present process could save energy, reduce emission and cost. Test results of the process were compared with common pre-plating processes (pre-plating of dumb-nickel plating, cyanide Cu pre-plating) and process used abroad. 2 years’ pilot production batches demonstratedand more than one year of production and Application that the present processes could be used on products for sanitary and architectural made of zinc alloy to substitute cyanide Cu pre-plating and pyrophosphate copper plating, with less procedures and cost on device, water, electricity, human resource, aiming to save water and reduce emission of wastewater containing copper. Moreover, the prospect of application on the flexible printed circuit board and transparent conductive film in the field of electronics and wearable devices was described. Keywords: cyanide-free copper coating with a high density; cyanide-free alkaline copper electroplating; cleaner production First-author’s address: Guangzhou Sanfu New Materials Technology Co., Ltd., Guangzhou 510663,China 收稿日期：2014–06–17 修回日期：2014–06–25 作者简介：詹益腾(1945–)，男，广东惠来人，研究员，国务院特殊津贴专家，总工程师，主要从事表面处理新工艺的研究。 作者联系方式：(E-mail) rd@ 无氰高密度碱性镀铜技术于2012年入选国家发改委、环境保护部、科学技术部和工信部联合颁布的《