ASM 自动焊线机器介绍Au wire bonding process.pptVIP

Section 9.3  Basic Au Wire Bond Process Contents Basic Introduction Gold Wire Bonder Bonding Sequence Material Tools Bond Quality Basic Introduction Understand an IC Package IC Manufacturing Flow Wire Bonding Introduction Cross-section of an IC Package IC Manufacturing Flow Wafer Grinding Gold Wire Bonding Wedge Bonding What technique is used in Gold Wire Bonding? Wire Bonding Techniques There are three basic wire bonding techniques: Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods. Ultrasonic bonding: utilizes ultrasonic and low impact